PART |
Description |
Maker |
200109MA |
2.0mm DUAL ROW HEADER OF VARIOUS HEIGHTS S.M.D. TYPE
|
SUYIN USA, INC.
|
200170MS |
2.0mm DUAL ROW ACTIVE EJECT PIN HEADER STRAIGHT TYPE
|
SUYIN USA, INC.
|
200170MR |
2.0mm DUAL ROW ACTIVE EJECT PIN HEADER RIGHT ANGLE TYPE
|
SUYIN USA, INC.
|
200238FR |
2.0mm DUAL ROW SOCKET RIGHT ANGLE DIP TYPE WITH SCREW
|
SUYIN USA, INC.
|
200236FR |
2.0mm DUAL ROW SOCKET RIGHT ANGLE DIP TYPE WITH SCREW
|
SUYIN USA, INC.
|
200138FR |
2.0mm DUAL ROW SOCKET RIGHT ANGLE DIP TYPE W/O NUT
|
SUYIN USA, INC.
|
ZP7-10-SS-G ZP7-36-SS-G ZP7-68-SS-G ZP7-20-SS-G ZP |
180隆? SMT - Dual Row Box Header 180° SMT - Dual Row Box Header
|
Yamaichi Electronics Co., Ltd.
|
0554014019 55401-4019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 40 Circuits, Lead-free MOLEX Connector
|
Molex Electronics Ltd.
|
70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0554011619 55401-1619 |
2.54mm (.100) Pitch QF-50?/a> Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free 2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free MOLEX Connector
|
Molex Electronics Ltd.
|
87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|